MEMS Manufacturing Technology

Protron Mikrotechnik works with all standard MEMS processes for silicon micromachining. Furthermore we use state of the art equipment for test and characterisation to offer processes and products with best possible quality.  


  • minimum structure width 1µm

Deposition and Thermal Processing

  • Oxidation Diffusion, Annealing
  • Low Pressure Chemical Vapor Deposition
  • Plasma Enhanced Chemical Vapor Deposition
  • Sputtering, Evaporation
  • Electroplating


  • Deep Reactive Ion Etching
  • Reactive Ion Etching
  • Wet Etching
  • Ion Milling Etching

Wafer Bonding

  • silicon fusion bonding
  • anodic bonding
  • eutectic bonding

Assembly and Packaging Technology

  • waferdicing
  • chipbonding
  • wirebonding

Test and Characterisation

  • wafer prober
  • 3D measurement system
  • film-thickness measurement tools
  • step height prober
  • surface profiler
  • film stress measurement system
  • 4-point resistivity prober
  • scanning electron microscope (SEM)
  • pressure test chamber
  • climatic exposure test cabinet